Samsung Introduces New Line-up of LED Components for Automotive Lighting, Featuring Chip-Scale Packaging

SEOUL, South Korea–(BUSINESS WIRE)–#FxCSP–Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging* and flexible circuit board technology, for use in automotive lighting applications. “Our new Fx-CSP line-up will bring greater design flexibility and cost competitiveness to the automotive lighting industry,” said Jacob Tarn, executive vice president, LED Business Team,
Source: BusinessWire-Primary

Samsung Introduces New Line-up of LED Components for Automotive Lighting, Featuring Chip-Scale Packaging